The bonding technology requires a hot melt application and the use of Hot Melt and Reactive Hot Melt (HMPUR) adhesives. The adhesives are melted prior to application thanks to the integrated pre-melting system. The automatic glue dosing system is governed by a central processing unit (CPU) that regulates all the system’s processes, the data processing, the set times, the alarms and the safety functions. Unlike traditional ones, this system simply eliminates the need for manual measurements of the quantity of adhesive to be applied, thus guaranteeing consistently correct doses including when the speed changes, and considerable savings. An “on site” opening system guarantees a safe and quick maintenance of the melting unit.

The Drum Melt applicator progressively heats only the necessary part of the adhesive surface, thus avoiding thermal stress and preserving the chemical/physical characteristics of the adhesive.